| 摘要 |
A planar packaged optical module in which shifting of an optical fiber and a ferrule from their design positions and positional displacement of an optical fiber within a ferrule resulting from a movement of the optical fiber therein can be prevented, and which is suitable for reflow soldering. The planar packaged optical module of the present invention is provided with a housing formed of epoxy resin or the like with a lid, an Si substrate provided within the housing, a semiconductor laser device provided on the Si substrate, a ferrule which is adhered to a notch portion provided on the housing and which retains an optical fiber therein, and an optical fiber which is adhered to the Si substrate in a state in which the optical fiber is passed from the exterior of the housing to the inside of the housing through the ferrule and disposed therein so that one end surface of the optical fiber opposes an active layer of the semiconductor laser device. The ferrule and the optical fiber are adhered to one another by an adhesive which has a glass-transition temperature Tg higher than the glass-transition temperature of the adhesive which adheres the housing and the ferrule to one another.
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