| 摘要 |
Apparatus for enabling the rapid installation of dual-in-line type integrated circuit modules in an electronic system, including a male connector frame which fits into a female frame to hold a set of circuit modules between them, the female frame being easily connected to the electronic system. The male and female frames each have many corresponding recesses, and have resilient conductive elements in the recesses. The circuit modules are first installed on the male frame with their leads lying over the elements in the male frame recesses. When the male frame is inserted into the female frame, the module leads are trapped between the elements on the male and female frames. The male frame is constructed of plastic material, and the bodies of the circuit modules are held thereon between an elongated heat sink that lies close to the male frame and a retainer member on a side of the modules opposite the heat sink.
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