发明名称 POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To polish all workpieces evenly even if a relative distance of any workpiece to a polishing part has a deviation. SOLUTION: A polishing device comprises a polishing head 22 with an abrasive sheet 23 attached to a top face, and a support mechanism 30 for supporting the polishing head 22 from below so that it can tilt. The support mechanism 30 comprises a base 21 for housing the polishing head 23 with the abrasive sheet 23 exposed out, and a coil spring 31 for supporting the polishing head 23 from below in the base 21 while allowing it to tilt.
申请公布号 JP2002326145(A) 申请公布日期 2002.11.12
申请号 JP20010130102 申请日期 2001.04.26
申请人 MITSUBISHI MATERIALS CORP 发明人 SUGIYAMA TATSUO;ITO KENICHI
分类号 G01R1/073;B24B9/00;(IPC1-7):B24B9/00;//G01R1/0 主分类号 G01R1/073
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