发明名称 |
Via structure with dual current path |
摘要 |
Provided is a via for use in a printed circuit board or integrated circuit having first, second, third, and fourth layers. The via includes a first path capable of transmitting a forward current from the first to the second layer and a second path capable of transmitting a return current resulting from the forward current from the third to the fourth layer to return to a source of the forward current.
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申请公布号 |
US6479764(B1) |
申请公布日期 |
2002.11.12 |
申请号 |
US20000568149 |
申请日期 |
2000.05.10 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FRANA ANDREW JAMES;GILLILAND DON ALAN |
分类号 |
H01R12/51;H05K1/02;H05K1/11;H05K1/16;H05K3/42;(IPC1-7):H01R12/04 |
主分类号 |
H01R12/51 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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