发明名称 |
NICKEL SILICIDE INCLUDING IRIDIUM FOR USE IN ULTRA-SHALLOW JUNCTIONS WITH HIGH THERMAL STABILITY AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PURPOSE: Nickel silicide including iridium for use in ultra-shallow junctions and method of manufacturing the same are provided to achieve improved thermal stability of a nickel silicide film. CONSTITUTION: A method of fabricating a nickel silicide on a silicon substrate comprises providing a silicon substrate, depositing iridium on the silicon substrate, depositing nickel on the silicon substrate wherein the nickel is in contact with the iridium, and annealing the iridium and the nickel to form a nickel silicide on the silicon substrate.
|
申请公布号 |
KR20020084824(A) |
申请公布日期 |
2002.11.11 |
申请号 |
KR20020024226 |
申请日期 |
2002.05.02 |
申请人 |
SHARP CORPORATION |
发明人 |
MAA JER-SHEN;ONO YOSHI;ZHANG FENG YAN |
分类号 |
H01L21/28;H01L21/285;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|