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发明名称
A method of filling a via or recess in a semiconductor substrate
摘要
申请公布号
AU2002308014(A1)
申请公布日期
2002.11.11
申请号
AU20020308014
申请日期
2002.04.22
申请人
TRIKON HOLDINGS LIMITED
发明人
JOHN MACNEIL
分类号
H01L21/027;H01L21/768;(IPC1-7):H01L21/768
主分类号
H01L21/027
代理机构
代理人
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