| 摘要 |
A multi-layer circuit board is provided that simultaneously optimizes impedance and interference within the multi-layer circuit board and a controlled impedance connector to which it is attached. The multi-layer circuit board includes at least one signal circuit layer, a plurality of signal contacts grouped in differential pairs and located on one signal circuit layer, and a plurality of ground contacts located on at least one ground circuit layer. The signal contacts are arranged in a pattern, or matrix, in which differential pairs of signal contacts are staggered in rows of the pattern. In accordance with an embodiment of the present invention, each differential pair of the multi-layer circuit board is more tightly coupled to a ground contact than to any other signal contact. The multi-layer circuit board, also includes a plurality of signal trace segments arranged in pairs. Both signal trace segments of a pair are equal in length and connect to signal contacts via linear routing channels. |
