| 摘要 |
PURPOSE: Thermal mechanical planarization in integrated circuits is provided to accommodate the low-k material when forming the interconnect and to achieve an inexpensive, high product throughput, and simple process. CONSTITUTION: A method for planarization of ILD layers on a semiconductor wafer(14) includes providing an oven having a wafer holder(26) therein, placing the semiconductor wafer on the wafer holder, and simultaneously applying mechanical pressure and heat to the ILD layer on the semiconductor wafer using a mechanical device.
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