| 摘要 |
FIELD: electrical engineering. SUBSTANCE: method for laser metallization of insulating substrate used for microelectronic devices including microwave hybrid integrated circuits is based on substrate surface treatment with laser beam. Novelty is that insulating materials used for the purpose are copper borates CuB2O4 and Cu3B2O6 in single- crystalline state and glass of CuO-B2O3 composition, and that insulating substrate is treated with laser radiation in atmosphere of hydrocarbon combustion products. Novelty is also that surface area on insulating substrate to be metallized is set to be of the same size as laser radiation spot and that copper layer thickness is controlled by varying power and time of exposure to laser beams. EFFECT: facilitated procedure, enhanced chemical purity of coating and its density and strength of adhesion to substrate. 2 cl, 1 dwg |
