发明名称 |
METHOD FOR CONTROLLING CONCENTRATION OF PLATING BATH AND DEVICE THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To maintain plating component concentration at a prescribed value by measuring the plating component concentration in a plating bath without sampling a plating solution. SOLUTION: A working electrode, a counter electrode and a reference electrode are immersed in the plating bath and these electrodes are connected with a potentiostat. A polarization curve of the plating bath is measured by using the potentiostat and critical current density between the working electrode and the counter electrode is obtained from the polarization curve and further the plating component concentration is obtained from the critical current density.
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申请公布号 |
JP2002322598(A) |
申请公布日期 |
2002.11.08 |
申请号 |
JP20010126485 |
申请日期 |
2001.04.24 |
申请人 |
FUJIKURA LTD |
发明人 |
USUI HIROKI;TANABE NOBUO;IWASAKI SHOJI |
分类号 |
G01N27/26;C25D21/12;G01N27/48;(IPC1-7):C25D21/12 |
主分类号 |
G01N27/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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