| 摘要 |
PROBLEM TO BE SOLVED: To provide a masking tape excellent in via-hole processability by UV laser method without leaving a residue on a via-hole wall or a via-hole bottom and capable of easily forming a finely processible via-hole. SOLUTION: In this masking tape, an adhesive layer is formed on one side of a base material layer having <=10% light transmittance of 300-380 nm wave length.
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