| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and a method for manufacturing a liquid crystal display(LCD) capable of suppressing cracks due to thermal distortion of a substrate and improving throughput. SOLUTION: In a method for manufacturing the semiconductor device for forming a semiconductor element on the substrate, temperature is increased step-by-step to heat the substrate 1, by transporting the substrate on heating boards 304, 305, and 306 during heat treatment of the substrate 1.</p> |
