发明名称 METHOD AND DEVICE FOR THERMALLY PEEL THE ADHEREND
摘要 PROBLEM TO BE SOLVED: To provide a method for thermally peeling an adherend capable of peeling only a part of adherends required in plural adherends and maintaining the other parts in the adhered state from a thermally peelable adherends having a layer containing thermally expansible small particles. SOLUTION: This method for thermally peeling an adherend performs to selectively peel a part of adherends of plural adherends adhered to a thermally peelable adhesive sheet having the layer including the thermally expansible small particles by a heating means for partially heating the adhesive sheet. This method for thermally peeling the adherend may include a process for cutting the adherend adhered to the adhesive sheet in plural cut pieces. The heating means has a heating unit corresponding to the shape of the adherend and can be installed to at least one side of the adhesive sheet out of the side adhered with the adherend and its opposite side.
申请公布号 JP2002322436(A) 申请公布日期 2002.11.08
申请号 JP20010128357 申请日期 2001.04.25
申请人 NITTO DENKO CORP 发明人 IZUMITANI SEIJI;KAWANISHI MICHIO;ARIMITSU YUKIO
分类号 C09J5/00;C09J5/08;C09J7/02;H01L21/00;H01L21/68;(IPC1-7):C09J5/00 主分类号 C09J5/00
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