| 摘要 |
PROBLEM TO BE SOLVED: To obtain an insulating adhesive composition which contains aluminium nitride and has high heat conductivity, and to provide a metal-based circuit board excellent in heat dissipation capacity which uses the same. SOLUTION: The resin composition in which a thermosetting resin contains aluminum nitride powder the particle size of which is 10-45μm and spherical aluminum oxide powder the maximum particle size of which is 3μm or less, and the metal-based circuit board using the same, are provided. Heat conductivity calculated from heat resistance between surface of the circuit and reverse side of the metal board is preferably 5.0 W/mK or more.
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