| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device where a value of resistance in a lead frame circuit can be suitably set. SOLUTION: The semiconductor device, composed of a semiconductor integrated circuit having a package with a lead frame, comprises a first connection terminal portion for connecting to the semiconductor integrated circuit and a second connection terminal portion consisting of multiple terminals that are provided between the first connection terminal portion and the semiconductor integrated circuit and are connected with wires to the semiconductor integrated circuit and the first connection part portion, respectively, and thus the values of the second connection terminal portion are different for each of the second connection terminals. |
