SEMICONDUCTOR LASER PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor laser package whose cost is low since a lead terminal is force-fitted to a resin base and which is superior in manufacturing efficiency. SOLUTION: The lead terminal 5 is force-fitted into a through hole 3 formed in the resin base 1. The upper face of the resin base 1 is covered with a metallic cover 11 and a semiconductor laser chip 9 is loaded on it. The chip is connected with the lead terminal 5 by wire 10. A projection 6 is formed so that the cross sectional area of a part of the lead terminal 5 becomes larger than the other part. The part is force-fitted into the through hole 3.