发明名称 CONDUCTIVE RESIN COMPOSITION AND CONTACT SUBSTRATE USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a conductive resin composition having superb conductivity, sufficient resistance to sulfidization which requires no carbon overcoat, and superb abrasion resistance, and to provide a contact substrate using the same. SOLUTION: The conductive resin composition comprises a silver powder consisting of mixed spherical granular particles and dendritic particles, which are dispersed in a binder resin. The amount of the spherical granular particles is set to be greater than the amount of the dendritic particles in order to form conductive paths by the spherical granular particles of silver powder and to interpose the dendritic particles between spherical granular particles.</p>
申请公布号 JP2002324428(A) 申请公布日期 2002.11.08
申请号 JP20010127584 申请日期 2001.04.25
申请人 ALPS ELECTRIC CO LTD 发明人 MATSUMORA SATORU
分类号 C08K3/08;C08L101/00;H01B1/00;H01B1/22;H01B5/16;H05K1/09;(IPC1-7):H01B1/22 主分类号 C08K3/08
代理机构 代理人
主权项
地址