发明名称 RESIN COMPOSITION FOR PLATING AND PLATED MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To obtain a PC/ABS-type resin composition for plating having improved plating property (adhesion strength, heat cycle property and plating appearance) of PC/ABS, particularly, having excellent plating property to a large-sized molded article or a complicated-shape molded article, and to provide a plated molded article using the same. SOLUTION: The resin composition for plating is obtained by blending from 0.1 to 30 pts.wt. of a terpene phenol copolymer (C) based on 100 pts.wt. of the composition comprising from 20 to 90 wt.% of a polycarbonate resin (A) and from 80 to 10 wt.% a rubber reinforced styrene-type resin (B). The plated molded article is obtained by plating a resin molded article produced by molding the resin composition.
申请公布号 JP2002322356(A) 申请公布日期 2002.11.08
申请号 JP20010129208 申请日期 2001.04.26
申请人 NIPPON A & L KK 发明人 FUJIWARA TAKAYOSHI;KODAMA MIKIO;TOYOTAKA TATSUJI
分类号 C08J7/06;C08L25/12;C08L51/04;C08L65/00;C08L69/00;C25D5/56;(IPC1-7):C08L69/00 主分类号 C08J7/06
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