发明名称 TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide treatment equipment provided with a plurality of treatment units wherein footprint can be made small without deteriorating throughput and causing a problem concerning device constitution. SOLUTION: The treatment equipment 100 performing a series of treatments containing liquid treatment to a substrate G is provided with a plurality of liquid treatment units 21, 23, 24 in which prescribed liquid treatment is performed while the substrate G is carried almost horizontally, and a plurality of heat treatment units sections 26, 27, 28 which are installed corresponding to the respective liquid treatment units 21, 23, 24 and in which a plurality of heat treatment units for performing prescribed heat treatment after corresponding liquid treatment are arranged intensively. In at least one of the heat treatment unit sections 26, 27, 28, a plurality of heat treatment units are arranged in the order of treatments.
申请公布号 JP2002324741(A) 申请公布日期 2002.11.08
申请号 JP20010125751 申请日期 2001.04.24
申请人 TOKYO ELECTRON LTD 发明人 TATEYAMA KIYOHISA;MOTODA KIMIO
分类号 B05C9/14;H01L21/027;H01L21/306;(IPC1-7):H01L21/027 主分类号 B05C9/14
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