发明名称 APPARATUS FOR CUTTING ELECTRONIC COMPONENT LEAD
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for cutting an electronic component lead where a lead cutting accuracy is high and assembly and maintenance are easy. SOLUTION: This apparatus consists of an upper blade 1 that can move up and down and a lower blade 2 fixedly installed, and the upper blade 1 is provided with a leading part 6 and the lower blade 2 is provided with a clearance groove 3. The lead 5 of the electronic component 4 with leads is set on the lower blade 2, and the lead 5 is cut by dropping the upper blade 1 and pressing in accordance with the clearance groove 3 provided at the lower blade 2. In addition, in assembly, by dropping the upper blade 1 and installing the upper blade 1 in the state that its side and the side of the lower blade 2 come into contact with each other, the clearance between the upper blade 1 and the lower blade 2 can be easily set at the prescribed value to be determined by the clearance groove 3.
申请公布号 JP2002324885(A) 申请公布日期 2002.11.08
申请号 JP20010126958 申请日期 2001.04.25
申请人 NEC CORP 发明人 NAWANO HIDEKI
分类号 B23D15/00;H01G13/00;H01L23/48;H01L23/50;(IPC1-7):H01L23/50 主分类号 B23D15/00
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