| 摘要 |
PROBLEM TO BE SOLVED: To provide a soft etching agent for a copper-cladded laminated board, which can extremely finely and uniformly finish the ruggedness of a copper surface, thus improves its adhesion with a DFR(dry film resist), enables the production of a printing circuit board with fine-wired patterns of high density, further reduces the content of expensive copper as resources, also enables the use of lead-free solder used at a temperature higher than that in the conventional solder, therefore eliminates the anxiety over lead pollution, and can improve the global environment. SOLUTION: Unsaturated alcohol is blended into a mixed solution of sulfuric acid and hydrogen peroxide.
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