| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that the manufacturing process of an electronic part requiring a diaphragm structure, such as an infrared sensor and a gas sensor, has a possibility that a thin diaphragm may be damaged, when forming a coating film having the uniform thickness with respect to an electronic circuit on a board formed in a diaphragm shape. SOLUTION: The coating film having uniform thickness can be acquired with respect to the electronic circuit on the board formed in the diaphragm shape, by using a photoresist as a mask, and by spraying, for example, a paint sealed in a spray can or the like.
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