发明名称 HIGH FREQUENCY INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a high frequency integrated circuit which is manufactured without a need for a complicated manufacturing process, reduces noise due to electromagnetic interference in the inside and is operated stably. SOLUTION: In the high frequency integrated circuit including a conductor being an earth, a circuit mounted on the conductor face and a cap protecting the circuit, the cap comprising a material capable of absorbing an electromagnetic wave, and the outside of the cap is a conductor layer. The material capable of absorbing the electromagnetic wave is an epoxy resin composition, and the high frequency integrated circuit is the epoxy resin composition including at least one kind selected from a curing agent, a hardening accelerator and a non-magnetic inorganic filler in addition to an epoxy resin and a flat metal magnetic material.
申请公布号 JP2002324863(A) 申请公布日期 2002.11.08
申请号 JP20010127550 申请日期 2001.04.25
申请人 MITSUI CHEMICALS INC 发明人 TSUZUKIYAMA KOUJI;TOGASHI EIKI;KONO YASUYUKI
分类号 H01L23/00;H01L23/02;H01L23/06;(IPC1-7):H01L23/00 主分类号 H01L23/00
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