| 摘要 |
PROBLEM TO BE SOLVED: To prevent resin chipping and terminal bending in the transportation between manufacturing processes in a method for manufacturing a semiconductor device using a hoop-shaped lead frame. SOLUTION: In a step of die bonding the semiconductor device 2 to the hoop-shaped lead frame 1 and resin sealing the semiconductor device by using a resin sealing mold, protrusions with the use of resin are provided between the semiconductor devices 2 on both upper and lower sides of the hoop-shaped lead frame 1. The height of the upper protrusion 3 is made higher than that of the resin sealed semiconductor device 2. By providing such protrusions, when wrapping the hoop-shaped lead frame, on which the resin sealed semiconductor device is mounted, around a reel, the resin sealed semiconductor devices can be prevented from interfering with each other. As a result, resin chipping and terminal bending can be prevented. |
