摘要 |
PROBLEM TO BE SOLVED: To solve the problem that an automatic part mounting machine misidentifies a defective wiring board area as a normal wiring board area and manufactures a defective electronic device as a result of the misidentification. SOLUTION: The multiple unit wiring board is constituted of the multiple unit board areas 2, where a plurality of metallic bumps 6 to which electrodes of the electronic parts are connected are arranged on the upper surface of a basic substance 4 for insulation, being integrally arranged in a length-to-width direction in a base board 1 with a plate-shape. At least one of the metallic bumps 6 in a defective wiring board area 2D is removed in each of the wiring board areas 2. The go or no go of each of the wiring board areas 2 can be surely judged by measuring the presence or absence of the metallic bumps 6.
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