发明名称 MULTIPLE UNIT WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To solve the problem that an automatic part mounting machine misidentifies a defective wiring board area as a normal wiring board area and manufactures a defective electronic device as a result of the misidentification. SOLUTION: The multiple unit wiring board is constituted of the multiple unit board areas 2, where a plurality of metallic bumps 6 to which electrodes of the electronic parts are connected are arranged on the upper surface of a basic substance 4 for insulation, being integrally arranged in a length-to-width direction in a base board 1 with a plate-shape. At least one of the metallic bumps 6 in a defective wiring board area 2D is removed in each of the wiring board areas 2. The go or no go of each of the wiring board areas 2 can be surely judged by measuring the presence or absence of the metallic bumps 6.
申请公布号 JP2002324956(A) 申请公布日期 2002.11.08
申请号 JP20010128211 申请日期 2001.04.25
申请人 KYOCERA CORP 发明人 TANIGUCHI GENTA
分类号 H05K3/34;H05K1/02;H05K3/00;(IPC1-7):H05K1/02 主分类号 H05K3/34
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