发明名称 CERAMIC MULTILAYER BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a ceramic multilayer board which lightens the degree of warping by making the directions of the warps between ceramic packages and dummy parts the same. SOLUTION: In the ceramic multilayer board 10 where a plurality of ceramic packages 11 equipped with cavities 12 surrounded by first surrounding walls 13 are arranged in a sheet form through the dummy parts 14, a recess 16 surrounded by a second surrounding wall 17b and substantially as deep as the cavity part 12 is made in each dummy part 14, and further division grooves 15 and 15a are made between the second surrounding wall 17 and the first surrounding wall 13 of the dummy part 14.</p>
申请公布号 JP2002324973(A) 申请公布日期 2002.11.08
申请号 JP20010129341 申请日期 2001.04.26
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 HIDAKA AKIHIRO;FUKUNAGA NORIKAZU
分类号 H05K1/02;H01L23/12;H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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