发明名称 NON-CONTACT IC DOCUMENT AND USAGE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a non-contact IC document and a usage thereof, capable of being used for physical distribution management of delivery slips or the like at low cost. SOLUTION: This non-contact IC document comprises an adhesive slip 10C which includes an addressee and is left at the addressee, a coupon 10B which includes RF-ID 100A and is left at the addressee, and a delivery slip 10A torn off a predetermined stripping line L1 for delivery confirmation. The coupon 10B can be cut off the adhesive slip 10C between a stripping printed layer 12 and a second pseudo-adhesive layer 15 along a predetermined cut-off line L2, and can be exchanged with compensation at an agent.
申请公布号 JP2002321827(A) 申请公布日期 2002.11.08
申请号 JP20010127367 申请日期 2001.04.25
申请人 DAINIPPON PRINTING CO LTD 发明人 TAMAI SHINPEI
分类号 B42D15/10;B42D11/00;B65G61/00;G06K19/00;G06K19/07 主分类号 B42D15/10
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