| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device where the connection between a resin and a metal and between the resin and an LSI can be secured, and to provide a manufacturing method therefor. SOLUTION: This semiconductor device, which comprises a semiconductor chip 4514 where a plurality of electrodes are formed on its surface, a metal piece that has a first surface and a second surface of the opposite side of this first surface, wires 4406, 4416 for connecting the electrode of the semiconductor chip 4514 to the first surface of this metal piece, and a sealing resin 4650 for sealing the semiconductor chip 4514 and the first surface of the metal piece for the second surface of the metal piece to be exposed, is characterized in that at least one part of the metal piece extends from one side of the semiconductor chip 4514 to the other side via the back side of the semiconductor chip 4514. |
