| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bonding device capable of performing soldering at high productivity without using flux. SOLUTION: The bonding device has a pressurizing part 6 for pressurizing a contact part by being pushed on the part to be contacted, a first gas jetting part 9 arranged so as to surround the circumference of the pressurizing part 6, and a second gas jetting part 8 arranged so as to further surround the outside of the first gas jetting part 9. In bonding, inert gas is jetted from the gas jetting parts 8, 9, and the space of the circumference of a pressurizing tool 6 is made a local low oxygen concentration space.</p> |
