| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic component wherein manufacturing time is reduced, cracks and warp are hardly generated and cost reduction is enabled, and to provide a method for manufacturing the electronic component. SOLUTION: Resin or compound material wherein powder type functional material is mixed with resin is formed in a thin plate type and cured, and a core substrate 9a is formed. A thin film conductor is formed on at least one out of a surface and a back of the core substrate 9a by using any one out of a vapor deposition method, an ion plating method, an ion beam method, a vapor growth method and a sputtering method and patterned, and conductor patterns 19-22 are formed by patterning. Resin or compound material wherein powder type functional material is mixed with resin is formed in a thin plate type and semi-cured, and a prepreg 9b is formed. The prepregs 9b and the core substrates 9a are laminated alternately and collectively formed integrally by using thermal press, and a laminated component is obtained.</p> |
