发明名称 SHIELD PROCESSING STRUCTURE AND METHOD OF MULTI- CONDUCTOR SHIELDED WIRE
摘要 <p>PROBLEM TO BE SOLVED: To enable strengthening the connection between a pair of resin members and to prevent a short circuit due to a grounding wire and an aluminum foil covering member contacting conductors and prevent degradation of strength of a multi-conductor shielded wire. SOLUTION: A shield processing structure is provided with the multi-conductor shielded wire 1 having a plurality of the shielded conductors 4, the aluminum foil covering member 6 for covering outer circumferences of the shielded conductors 4 and an insulation jacket 7 for covering outer circumference of the aluminum foil covering member 6, and a pair of the resin members 10, 11 having recesses 10b, 11b corresponding to an outer cross-sectional shape of the multi-conductor shielded wire 1. The multi-conductor shielded wire 1 is put between a pair of the resin members 10, 11 and is disposed in the recesses 10b, 11b; one end of the grounding wire 13 is interposed between the multi-conductor shielded wire 1 and the resin member 10; ultrasonic vibration is applied between a pair of the resin members 10, 11 in an interposed state; a contacting part between a conductor 13a and the aluminum foil covering member 6 is formed; and protrusions 10c, 11c are provided on joint faces 10a, 11a of the resin members 10, 11.</p>
申请公布号 JP2002325327(A) 申请公布日期 2002.11.08
申请号 JP20010128253 申请日期 2001.04.25
申请人 YAZAKI CORP 发明人 IDE TETSUO;MITA AKIRA;ASAKURA NOBUYUKI
分类号 H02G1/14;H02G15/08;(IPC1-7):H02G1/14 主分类号 H02G1/14
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