| 摘要 |
<p>PROBLEM TO BE SOLVED: To resolve a problem where the distance between adjacent wiring layers becomes shorter and thus the reliability of electrical insulation between the wiring layers is low. SOLUTION: In the wiring board 5 where a plurality of internal wiring layers 2 are formed inside an insulating substrate 1 and a plurality of connection pads 3 to be electrically connected with the internal wiring layers 2 are formed on its surface, the internal wiring layers 2 are formed using tungsten and/or molybdenum and copper and the connection pads 3 are formed using tungsten and/or molybdenum and an iron group metal.</p> |
