IC MOUNTING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To perform an IC mounting with a simple, easy manner and high reliability even when there are no bumps on the IC side. SOLUTION: In forming the bump 2 to be an IC mounting terminal portion by covering a surface of a protruding portion 11 arranged on a surface of a base material with a conductive metal layer to be a circuit pattern, a surface of the bump 2 is formed so that minute unevenness 20 with a surface roughness Ra 0.1-3μm continues. A connection resistance is significantly reduced by existence of the minute unevenness 20.