| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging device that can be assembled with high precision in spite of its compact configuration and to provide an assembling method for the imaging device. SOLUTION: A 1st region C1 with a conductor film is formed to an assembling position of an image pickup device 2b on a board PC, and a 2nd region C2 with a conductor film whose size is equal to or slightly greater than the size of a mirror frame 4 at a position with a prescribed relation of the 1st region C1. When the mirror frame 4 is placed on the 2nd region C2, an amount of the 2nd region protruded from the mirror image 4 is visually confirmed or optically detected to attain positioning of the mirror frame 4, that is a lens section 1a with respect to the image pickup device 2b with high precision.
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