CONTROLLER AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To prevent such a trouble that solder jetting at flow soldering contacts the projection projected below the soldering face of a wiring board, of a heat sink large in heat radiation thereby radiating heat partially and producing a solder slag in an icicle form, even in soldering with lead-free solder. SOLUTION: The heat sink 8 is fixed to the wiring board before soldering, and the tip 8b of the projection 8a provided at one end of the heat sink 8 for a stopper at that time is positioned within the through hole 4a of the wiring board 4, and solder is applied to the soldering face 4b on opposite side from the heat sink attachment face of the wiring board.