| 摘要 |
PROBLEM TO BE SOLVED: To accurately recognize a defective part in a semiconductor wafer. SOLUTION: In a plurality of semiconductor wafers, a pattern exposed on the surface of one semiconductor wafer 006 is stored as a main image in a main image storage part, and a pattern exposed on the surfaces of another semiconductor wafer 007 and matching the pattern of the semiconductor wafer 006 is stored as an auxiliary image in an auxiliary image storage part. Inspection is carried out by comparing the main image and the auxiliary image with each other. In this way, an image of every wafer is recognized and compared, so that an erroneous recognition occurring in a cell comparison method or in a chip comparison method can be reduced.
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