发明名称 PHOTORESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photoimageable composition having improved strippability and containing an organic acid, a method of improving the strippability of the photoimageable composition and a method of manufacturing a printed wiring board by using such photoimageable composition. SOLUTION: The photoresist composition is prepared by combining typically a polymeric binder, a photoactive compound, an organic acid, optically a cross- linking agent, optically a solvent and optically additives in optical order.
申请公布号 JP2002323757(A) 申请公布日期 2002.11.08
申请号 JP20010362861 申请日期 2001.11.28
申请人 SHIPLEY CO LLC 发明人 KOES THOMAS A
分类号 G03F7/004;G03F7/027;G03F7/42;H05K3/00 主分类号 G03F7/004
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