| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an IC package device for high frequency where good heat-dissipation characteristics can be secured and that meets the requirements of good high frequency characteristics even if load impedance is higher than input impedance. SOLUTION: An IC chip 7 for high frequency is mounted at the position nearer to the output terminal side than the input terminal side on the cavity part C of a dielectric substrate 1. A stripline is constituted by an internal electrode pattern 41 buried in the dielectric substrate 1 and a ground electrode 6 on the input terminal side of the IC chip 7, and a non-stripline is constituted by wirings, in which an external electrode pattern 10 that is provided on the surface of the dielectric substrate 1 and is connected to the output terminal and an internal electrode pattern 42 that is buried in the dielectric substrate 1 and is connected to the IC chip 7 are connected via a through hole 9.</p> |
