发明名称 CIRCUIT BOARD FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a circuit board for mounting electronic components in a construction having capacitance effect by a three-layer construction without covering wiring patterns by which the degree of freedom of changing the wiring patterns is increased and electromagnetic waves generated from electronic components can be efficiently shielded. SOLUTION: First and second circuit boards 4 and 5 are held with a specified spacing by adjusting sizes and are placed approximately in parallel with each other. A first region R1 is ensured on the first circuit board 4 and an A-type electronic component 11 generating electromagnetic waves is mounted in the region R1. First and second conductor layers 14 and 15 are opposed to each other through an air layer on both opposed sides 5a and 4b of the circuit boards 4 and 5 corresponding to the direction of lamination in the first region R1. One of the conductor layers 14 and 15 is connected to the ground and the other is connected to a power source. In this way, a three-layer construction having capacitance effect is formed and the electromagnetic waves generated from the A-type electronic component 11 can be efficiently shielded.
申请公布号 JP2002324954(A) 申请公布日期 2002.11.08
申请号 JP20010126343 申请日期 2001.04.24
申请人 DENSO CORP 发明人 KATO MASAHIRO
分类号 H05K9/00;H05K1/02;H05K1/14;(IPC1-7):H05K1/02 主分类号 H05K9/00
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