| 摘要 |
PROBLEM TO BE SOLVED: To obtain a structure for installing a power amplifier IC that is effective for miniaturization/ increased heat generation. SOLUTION: This structure comprises a metal chassis having a storing part for a power amplifier IC near its periphery, a circuit board that is installed on the bottom surface of the chassis and has through holes for connecting the power amplifier IC, the power amplifier IC that is installed perpendicular to the circuit board with soldering by inserting a connection terminal into the through hole of the circuit board and is mounted so that one surface of a metal plate for heat dissipation comes in contact with a holding protrusion provided on the storing part for the power amplifier IC, and a radiation fin that is adhered to the other surface of the metal plate for heat dissipation and is fixed to the chassis so as to put the metal plate for heat dissipation of the power amplifier IC between the chassis and the radiation fin.
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