| 摘要 |
1,152,493. Semi-conductor devices. ROBERT BOSCH G.m.b.H. 15 June, 1966 [26 June, 1965], No. 26590/66. Heading H1K. The metal casing 3 of a semi-conductor component 4 is sealed at its open end by synthetic resin 2 which is poured in and allowed to harden, the interior of the casing being formed with at least one sealing lip 3a which is enclosed on both sides by portions 2a, 2b of the resin which are thicker than the lip. |
