| 摘要 |
The problems outlined above may in large part be solved by a system and method for testing integrated passive components in a printed circuit board. In one embodiment, testing of integrated passive components may be conducted prior to completing the final lamination of the printed circuit board. The testing may be conducted on a tester having movable test probes. The method may include connecting a first test probe to a conductive plane, which may be electrically connected to the first terminals of two or more components. The conductive plane may be a ground plane, a power plane, or a signal plane. The first test probe may remain in a fixed position throughout the testing. A second test probe may be electrically connected to the second terminal of the first component. Following the connection of the second test probe, an electrical characteristic of the first component may be measured. Following the measurement of an electrical characteristic of the first component, the second test probe may then be repositioned in order to be electrically connected to the second terminal of a second component. After repositioning and electrically connecting the second test probe to the second terminal of the second component, an electrical characteristic of the second component may be measured. This may be repeated for any number of components to be tested. The first test probe, which is electrically connected to a conductive plane to which each of the tested components is electrically connected, may remain in a fixed position throughout the testing, while the second test probe moves from component to component.
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