| 摘要 |
Methods for selectively moving a microelectronic-device substrate assembly in a processing machine having a first side, a second side opposite the first side, and a processing path extending from the first side to the second side. The processing machine can also include a cassette proximate to a second side of the processing station that moves to position a substrate at the processing path. In one aspect of the invention, the substrate handling apparatus includes a guide member attached to the processing machine, an arm slidably attached to the guide member, and a clamp attached to the arm. The guide member is generally fixedly attached to the processing machine, and the guide member generally has a shape corresponding to the processing path. The arm can include a first section moveably attached to the guide member to translate along the guide member, and a second section projecting from the first section to position at least a portion of the second section at least proximate to the processing path. The clamp is coupled to the second section of the arm in alignment with the processing path. A motor is coupled to the arm via a drive member to move the arm along the guide member between a first position in which the clamp is near the first side of the plate assembly and a second position in which the clamp is near the cassette at the second side of the plate assembly.
|
