METHOD FOR BONDING WAFERS TO PRODUCE STACKED INTEGRATED CIRCUITS,申请号WO2002US14209-传众专利搜索

发明名称	METHOD FOR BONDING WAFERS TO PRODUCE STACKED INTEGRATED CIRCUITS
摘要	A stacked integrated circuit constructed by bonding the integrated circuit wafers together utilizing bonding pads as shown in Figure (8), wherein wafer (202) is stacked on wafer (201).
申请公布号	WO02089197(A1)	申请公布日期	2002.11.07
申请号	WO2002US14209	申请日期	2002.04.30
申请人	TACHYON SEMICONDUCTOR CORPORATION	发明人	GUPTA, SUBHASH;HO, PAUL, KWOK, KEUNG;HONG, SANGKI
分类号	H01L21/768;H01L23/48;H01L25/065	主分类号	H01L21/768
代理机构		代理人
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