发明名称 |
Split-mold and method for manufacturing semiconductor device by using the same |
摘要 |
A split-mold, which is used for manufacturing semiconductor devices by resin-encapsulating a substrate on which a plurality of semiconductor chips are formed, includes a first mold and a second mold. The second mold has a pressing surface that is provided with a mold release sheet. The second mold has a mold-release-sheet mechanism holding a mold release sheet outside the pressing surface of the second mold and applying tension to the mold release sheet. |
申请公布号 |
US2002164391(A1) |
申请公布日期 |
2002.11.07 |
申请号 |
US20020186997 |
申请日期 |
2002.07.02 |
申请人 |
FUJITSU LIMITED OF KAWASAKI |
发明人 |
SHINMA YASUHIRO |
分类号 |
H01L23/28;B29C43/18;H01L21/00;H01L21/56;(IPC1-7):B29C70/72 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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