发明名称 |
SEMICONDUCTOR COMPONENT, PARTICULARLY A MICROMECHANICAL PRESSURE SENSOR |
摘要 |
The invention relates to, in particular, a semiconductor component, particularly a micromechanical pressure sensor (200), comprising a membrane electrode (206), a cavity (208), which is located underneath the membrane, and a bottom electrode (202, 203), which is also located underneath the membrane. In order to improve the reliability of the semiconductor component, the invention provides, in particular, a bottom electrode that is comprised of a first and a second electrode (202, 203), whereby the second electrode (203) surrounds the first electrode (202) to a large extent. |
申请公布号 |
WO02088654(A2) |
申请公布日期 |
2002.11.07 |
申请号 |
WO2002DE01151 |
申请日期 |
2002.03.28 |
申请人 |
ROBERT BOSCH GMBH;JUNGER, ANDREAS;BENZEL, HUBERT;ESCHRICH, HEINZ;NITSCHE, JUERGEN;SCHAEFER, FRANK;VOSSENBERG, HEINZ-GEORG |
发明人 |
JUNGER, ANDREAS;BENZEL, HUBERT;ESCHRICH, HEINZ;NITSCHE, JUERGEN;SCHAEFER, FRANK;VOSSENBERG, HEINZ-GEORG |
分类号 |
G01L9/00 |
主分类号 |
G01L9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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