发明名称 |
Methods of forming microstructure devices |
摘要 |
The invention includes methods of forming microstructure devices. In an exemplary method, a substrate is provided which includes a first material and a second material. At least one of the first and second materials is exposed to vapor-phase alkylsilane-containing molecules to form a coating over the at least one of the first and second materials.
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申请公布号 |
US2002164879(A1) |
申请公布日期 |
2002.11.07 |
申请号 |
US20010850923 |
申请日期 |
2001.05.07 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
LEUNG TOI YUE BECKY;CHINN JEFFREY D. |
分类号 |
B81B3/00;B81C1/00;(IPC1-7):H01L21/302;H01L21/461;H01L21/31;H01L21/469 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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