发明名称 Methods of forming microstructure devices
摘要 The invention includes methods of forming microstructure devices. In an exemplary method, a substrate is provided which includes a first material and a second material. At least one of the first and second materials is exposed to vapor-phase alkylsilane-containing molecules to form a coating over the at least one of the first and second materials.
申请公布号 US2002164879(A1) 申请公布日期 2002.11.07
申请号 US20010850923 申请日期 2001.05.07
申请人 APPLIED MATERIALS, INC. 发明人 LEUNG TOI YUE BECKY;CHINN JEFFREY D.
分类号 B81B3/00;B81C1/00;(IPC1-7):H01L21/302;H01L21/461;H01L21/31;H01L21/469 主分类号 B81B3/00
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