METHOD FOR SEPARATING ELECTRONIC COMPONENTS FROM A COMPOSITE

摘要

The invention relates to methods for separating thin chips from a sawn wafer, according to which the wafer is first glued to a carrier and is sawn into individual chips on said carrier. The components are subsequently detached from the carrier individually or in groups. The method is characterised in that the carrier is a rigid plate and the adhesive is thermally soluble, whereby the adhesive is rendered inactive by means of heat passing either through the chip itself or through the carrier. The chip is then detached.