发明名称 METHOD FOR MOUNTING ELECTRONIC PART ON FLEXIBLE PRINTED WIRING BOARD AND ADHESIVE SHEET FOR FIXING FLEXIBLE PRINTED WIRING BOARD
摘要 A flexible printed wiring board (4) is fixed to a pressure−sensitive adhesive layer of a fixing sheet (6), and an electronic part is mounted on the flexible printed wiring board (4). Alternatively, an adhesive sheet (5) is bonded to the opposite side to the side, where an electronic part is to be mounted, of the flexible printed wiring board (4), the flexible printed wiring board is fixed to the fixing sheet (6) through the adhesive sheet (5), and an electronic is mounted on the flexible printed wiring board (4). The adhesive sheet (5) for fixing the flexible printed wiring board (4) to the fixing sheet (6) has a pressure−sensitive layer at least on one side of its porous base. The storage elastic modulus (frequency : 1 Hz) of the pressure−sensitive adhesive layer lies in a range of 10<sp>3</sp> to 10<sp>6</sp> Pa at 0 to 300 ° C. Projections or dents can be formed on or in the pressure−sensitive adhesive layer.
申请公布号 WO02089553(A1) 申请公布日期 2002.11.07
申请号 WO2002JP03610 申请日期 2002.04.11
申请人 NITTO DENKO CORPORATION;MUTA, SHIGEKI;TANAKA, KAZUMASA;SANO, KENJI;YAMAMOTO, HIROSHI;IKEDA, KOICHI;YOKOYAMA, JUNJI 发明人 MUTA, SHIGEKI;TANAKA, KAZUMASA;SANO, KENJI;YAMAMOTO, HIROSHI;IKEDA, KOICHI;YOKOYAMA, JUNJI
分类号 H05K1/00;H05K3/00;H05K13/04;(IPC1-7):H05K13/04;H05K3/34;C09J7/02 主分类号 H05K1/00
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