发明名称 |
Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
摘要 |
A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of semiconductor chips with unique chip carriers to achieve the three dimensional array of chips. The method includes a step of depositing solder on a multitude of chip carriers at one time, placing the chip carriers with chips on a printed circuit board and then running the board with chips and carriers arranged in a three dimensional array through a single reflow oven to complete a single reflow process to permanently connect all of the components. The apparatus includes a unique chip carrier pallet and print fixture pedestal that work in combination to position the chip carriers for the automatic deposition of solder on a multitude of carriers at once and then position them for addition to the circuit board.
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申请公布号 |
US2002162215(A1) |
申请公布日期 |
2002.11.07 |
申请号 |
US20020098269 |
申请日期 |
2002.03.14 |
申请人 |
KLEDZIK KENNETH J. |
发明人 |
KLEDZIK KENNETH J. |
分类号 |
H01L25/00;H01L25/10;H01L25/11;H01L25/18;H05K1/14;H05K3/30;H05K3/34;H05K3/36;H05K13/04;(IPC1-7):B23P19/00 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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